Sanding heat sinks

Airwalker16

Airwalker16

Well-Known Member
Isawthelight said:
from HITHERM
Adhesive Orientation from Airwalker16's pdf attachment...
The preferred orientation of the part is adhesive facing the heat sink. Testing has demonstrated negligible advantage to orienting the adhesive side of the part towards the heat sink compared to the LED substrate. However if there is a manufacturing advantage to bonding the adhesive to the LED, it is recommended the thermal designer evaluate both orientations to compare the manufacturing / performance tradeoff.

HITHERM says the heat will flow equally well no matter which way the TIM sits. Maybe Adhesive down is preferred because it is easier to clean cooked glue off your heat sink than your cob?
Click to expand...
Very good information, friend. I'm sure that'd be easier to clean as well. But man, I'm so temped to stick it on the chip. Only reason I'd be removing it, is if it needed to be replaced! Which brings us to the fact that sticking it TO THE HEATSINK, would Indeed making it reusable a reality, rather than being on the chip itself (not happening). So many variables, but I think the pros outweigh the cons to sticking it to your aluminum.
 
Jp.the.pope

Jp.the.pope

Well-Known Member
Airwalker16 said:
Very good information, friend. I'm sure that'd be easier to clean as well. But man, I'm so temped to stick it on the chip. Only reason I'd be removing it, is if it needed to be replaced! Which brings us to the fact that sticking it TO THE HEATSINK, would Indeed making it reusable a reality, rather than being on the chip itself (not happening). So many variables, but I think the pros outweigh the cons to sticking it to your aluminum.
Click to expand...
I think the issue is you cannot reuse the pad due to compression. I put my stickers on the COB with the understanding I would only be opening the light to replace* a COB.

I made sure to have extras just in case I need to make a change. Granted I won't know for sure until I run them for a while.
 
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