Airwalker16
Well-Known Member
Very good information, friend. I'm sure that'd be easier to clean as well. But man, I'm so temped to stick it on the chip. Only reason I'd be removing it, is if it needed to be replaced! Which brings us to the fact that sticking it TO THE HEATSINK, would Indeed making it reusable a reality, rather than being on the chip itself (not happening). So many variables, but I think the pros outweigh the cons to sticking it to your aluminum.from HITHERM
Adhesive Orientation from Airwalker16's pdf attachment...
The preferred orientation of the part is adhesive facing the heat sink. Testing has demonstrated negligible advantage to orienting the adhesive side of the part towards the heat sink compared to the LED substrate. However if there is a manufacturing advantage to bonding the adhesive to the LED, it is recommended the thermal designer evaluate both orientations to compare the manufacturing / performance tradeoff.
HITHERM says the heat will flow equally well no matter which way the TIM sits. Maybe Adhesive down is preferred because it is easier to clean cooked glue off your heat sink than your cob?