NoFucks2Give
Well-Known Member
There you go again, so very wrong. Delusions of adaquacy. If you want to know why you are wrong go to TI's Web Bench or get an account with heatsinkcalculator.com and you will see that natural convection requires buoyancy, the copper surface is opposing gravity and no available vertical air flow will not allow natural convection to work very well. Thermal exchange between an extended copper pad and the bottom side of the PCB is used on FR4 boards (see attached) not MCPCBs. The MCPCB is single sided which does not allow for thermal vias to transfer heat. The metal core does that just fine without the pad.But wrong? Never ever.
The man has some boards that work and he is happy. You only have a bad attitude.
Notice especially the difference between the pad layout in the rebelRecomendationsPCB.pdf
The MCPCB does not have top side copper pads. Whereas the FR4 pads have ext3endded pads with thermal vias.
The tabs on the MCPCB pads is for solder inspection not thermal relief.
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