ChiefRunningPhist
Well-Known Member
At the end of the day no substrate will be king. Any material layer between the die and the pcb is a thermal barrier. Flip chip is great and eventually CSP will be the future soon.
Interesting, I've had thermal mentioned to me a few times before and just thought if the correct MCL or MCPCB was used it shouldn't really matter, but after seeing what CSP is (and flip chip), my opinion may need adjusting lol. Do you know if that green Nichia 1717 is a flip chip?
Height of 0.35mm, max rated 1.8W (550mA)
I stumbled across this pic a while ago and was curious about the MCOB tech. It looked similar to some chips I think I've seen before and looked like it had better thermal mgmt, was curious how it stacked in effeciency vs traditional COB and mid power packages..